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GlobeNewsWire
28 days ago
STMicroelectronics to advance next-generation chip manufacturing technology with new PLP pilot line in Tours, France
PR N°C3358C STMicroelectronics to advance next-generation chip manufacturing technology with new PLP pilot line in Tours, France Multi-disciplinary team to further develop innovative approach to chip packaging and test manufacturing technology boosting efficiency and flexibility Part of ST's strategic initiative on heterogeneous integration, contributing to technology roadmap on RF, analog, power and digital products Launch of the PLP pilot line in Tours supported by $60 million investment and synergies with local R&D ecosystem Geneva, Switzerland, September 17, 2025 -- STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, today announced new details regarding the development of the next generations of Panel-Level Packaging (PLP) technology through a pilot line in its Tours site, France, which is expected to be operational in Q3 2026. PLP is an advanced, automated chip packaging and test process technology bringing increased manufacturing efficiency and reducing costs, and a key enabler for creating the next generation of smaller, more powerful, and cost-effective electronic devices.