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GlobeNewsWire
8 days ago
SCHMID Introduces “Any Layer ET” Process for Full Panel-Level Advanced Packaging and Announces Speaking Engagement at ECTC 2026
FREUDENSTADT, Germany, April 30, 2026 (GLOBE NEWSWIRE) -- SCHMID Group (NASDAQ: SHMD), a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its proprietary Any Layer ET (Embedded Trace) Process for full panel-level Advanced Packaging. As AI, high-performance computing (HPC), advanced server architectures, and heterogeneous integration continue to drive unprecedented substrate complexity, manufacturers face increasing requirements for ultra-fine line structures, superior signal integrity, enhanced power delivery, and scalable production platforms capable of supporting high-volume manufacturing.