CEVA Inc

CEVA

Market cap $620M

ROCKVILLE, Md., Jan. 13, 2026 /PRNewswire/ -- Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, will announce results for the fourth quarter and full year 2025 on February 17, 2026 before the NASDAQ market opens.

Integration of Ceva's AI DSP in NXP's S32Z2 and S32E2 real-time processors enables predictive analytics, energy management and intelligent control for software-defined vehicles LAS VEGAS, Jan. 6, 2026 /PRNewswire/ -- CES 2026 -- As vehicles evolve into software-defined platforms, the demand for real-time processing, safety, and intelligence is accelerating. Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, today announced that NXP® Semiconductors has integrated Ceva's AI DSP into its S32Z2 and S32E2 processors, designed to power the next generation of real-time domain and zonal control modules in software-defined vehicles.

Eagle-A leverages SensPro™ to accelerate LiDAR and radar sensing workloads for real-time perception and sensor fusion LAS VEGAS , Jan. 6, 2026 /PRNewswire/ -- As vehicles evolve toward software-defined architectures and complex ADAS, the industry is turning to real-time sensor processing, safety-critical intelligence, and physical AI to bridge perception and actuation. In line with this trend, Ceva, Inc. (NASDAQ: CEVA) today announced that BOS Semiconductors has licensed its SensPro™ AI DSP architecture for the Eagle-A standalone ADAS System-on-Chip (SoC).

Sensory's industry-leading embedded voice wake word technology is now available for NeuPro-Nano, enabling ultra-low power, always-on applications in next-gen Edge AI SoCs LAS VEGAS, Jan. 5, 2026 /PRNewswire/ -- CES 2026 -- As demand surges for AI-driven, voice-first user experiences in ultra-low power devices, Ceva, Inc. (NASDAQ: CEVA) is expanding its extensive AI ecosystem for the NeuPro-Nano NPU to meet the moment. Today, Ceva and Sensory Inc. announced a collaboration to enable Sensory's TrulyHandsfree™ voice activation technology on the NeuPro-Nano, enhancing Ceva's edge AI ecosystem with a proven, power-efficient voice activation solution.

Ceva-XC21™ Recognized for advancing cellular IoT and 5G connectivity with ultra-efficient, AI-enabled DSP architecture for cost-sensitive IoT and smart-home devices ROCKVILLE, Md. , Dec. 5, 2025 /PRNewswire/ -- Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, today announced that its Ceva–XC21™ IoT communication DSP has been awarded Best IP/Processor of the Year at the prestigious EE Awards Asia ceremony in Taipei.

It announced a fresh round of capital-raising. This is taking the form of a secondary common stock flotation of at least 3 million shares.

ROCKVILLE, Md. , Nov. 18, 2025 /PRNewswire/ -- Ceva, Inc. (NASDAQ: CEVA) today announced the pricing of an underwritten public offering of 3,000,000 shares of its common stock at a price to the public of $19.50 per share.

ROCKVILLE, Md. , Nov. 17, 2025 /PRNewswire/ -- Ceva, Inc. (NASDAQ: CEVA) today announced that it has commenced an underwritten public offering of 3,000,000 shares of its common stock.

Award highlights Ceva's NeuPro –Nano NPU as a cornerstone of edge AI, trusted by consumer and industrial innovators for smart edge deployments ROCKVILLE, Md. , Nov. 17, 2025 /PRNewswire/ -- Ceva, Inc. (NASDAQ: CEVA), the leading licensor of silicon and software IP for the Smart Edge, announced today that its Neu-Pro-Nano low power Neural Processor Unit (NPU) has received a 2025 IoT Edge Computing Excellence Award from IoT Evolution World, the leading web site covering the Internet of Things (IoT) marketplace.

First product based on collaboration, the IntelPro IPRO7AI, integrates multi–mode wireless, security, multimedia, and AI processing to power next–generation smart home, industrial, and consumer IoT devices ROCKVILLE, Md. , Nov. 13, 2025 /PRNewswire/ -- As artificial intelligence and seamless connectivity converge to redefine the Internet of Things (IoT), demand is rising for platforms that combine low–power wireless, security, multimedia, and on–device AI.